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[tools/mec] Bump version #14366

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merged 1 commit into from
Nov 26, 2024
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@batcheu batcheu commented Nov 26, 2024

This will bump the package version from '0.0.2' to '0.1.0'.

This will bump version to 0.1.0

ONE-DCO-1.0-Signed-off-by: Jonghwa Lee <[email protected]>
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batcheu commented Nov 26, 2024

Changes since from v0.0.2

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LGTM

@seanshpark seanshpark merged commit ee810f9 into Samsung:master Nov 26, 2024
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@batcheu batcheu deleted the me_adapter/update_ver branch November 26, 2024 08:07
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2 participants